Job Ref: L8W49X6RQualification :10-15 years of experience in process engineering, assembly engineering,or a related field in the Semiconductor industry.Background in Die bond / Wire bond process with high volume production managementStrong analytical and troubleshooting abilities to resolve production issues effectively.Supervisory and Management skillsGood knowledge in LEAN, SIX SIGMA, SPC, MSA, etc.Good Command of English.
