About the CompanyA leading global manufacturing solutions provider specializing in high-precision optical, electronic, and mechanical assembly services. The company supports complex production needs across industries such as semiconductors, automotive, and telecommunications, with a strong focus on quality, innovation, and customer satisfaction.Job Responsibilities
Translate organizational goals into actionable and measurable objectives.
Lead yield improvement initiatives, ensuring timely execution.
Analyze quality issues and implement corrective actions to optimize output and customer satisfaction.
Drive continuous improvement projects to reduce product return rates.
Develop and mentor engineering talent to ensure long-term organizational capability.
Maintain process control using statistical tools such as SPC.
Collaborate with design centers and technical teams to manage product/process changes and technology transfers.
Plan and manage budgets within the product line.
Understand customer expectations and lead initiatives to meet or exceed them
Experience requirements
10-15 years of experience in process or assembly engineering within the semiconductor industry.
Expertise in high-volume Die Bond / Wire Bond processes.
Strong analytical and problem-solving skills for production issue resolution.
Proven leadership and team management capabilities.
Solid knowledge of LEAN, Six Sigma, SPC, MSA, and related methodologies.
